| The Aqua series of UNCD®
films from ADT are the only phase-pure nanocrystalline diamond films
in the world. Other nanocrystalline diamond films are comprised
of graphitically-bonded material intermixed with crystalline diamond
grains. In contrast, UNCD films have no amorphous graphitic
phases. The results are films that capture the hardness, modulus
and other extreme properties of natural diamond but are also smooth
and have very low internal stresses.
ADT currently offers two families of UNCD wafers:
- DoSi™ Wafers (diamond on silicon)
- UNCD DOI™ Wafers (diamond on insulator)
DoSi™ Wafers
UNCD DoSi Wafers have the following benefits:
- Mirror smooth for outstanding control of surface properties.
- Available with high or low thermal conductivity for insulating or
heat transfer applications.
- Outstanding uniformity for higher yields.
- Tunable electrical conductivity allows for precise engineering of
films properties to suit specific applications.
- Mechanical and electrical properties can be engineered according to
customer-specific needs.
UNCD DoSi Wafers are offered in four varieties on 100, 150 and
200 mm silicon wafers. Please see the brochure
for detailed specifications, and the price
list for current offerings. To order, click
here.
UNCD DOI Wafers
UNCD DOI wafers consist of heterostructures of UNCD® Aqua
films integrated with oxides and metals onto silicon wafers suitable
for prototyping and/or process development. They meet a set of
baseline wafer-level specifications for thickness/ property uniformity,
wafer bow, and particle counts suitable for direct insertion into
a MEMS foundry process sequence. All DOI wafers are available
in 100, 150 and 200mm wafers. UNCD DOI wafers come in two varieties:
UNCD/SiO2/Si(100)
Standard silicon wafers coated with a thermal SiO2 layer
(nominal 1 micron thickness) followed by UNCD Aqua 25, 40, 50,
or 100. These substrates are ready for further MEMS processing
using standard surface micromachining techniques to make UNCD-based
cantilevers, resonators, diaphragms, windows, etc. To order these
DOI wafers, click here.
Al/UNCD/W/SiO2/Si(100)
Standard silicon wafers layered with thermal SiO2, followed by
a 50 nm tungsten electrode layer, followed by UNCD, and then coated
with an aluminum electrode layer to form low resistance ohmic
contact with the diamond. These substrates are suitable for both
MEMS and electronic device applications such as MESFETs and field
emission-based devices. To order these UNCD DOI wafers, please
contact ADT.
Blog about UNCD Wafers at The
Diamond Revolution. |
